Sr. No. | Type | Method of construction | Ref. |
---|---|---|---|
Solid MNs | |||
1.1.1. | Silicon MNs | Microelectromechanical systems (MEMS) techniques, thin-film deposition on a substrate, chemical vapor deposition on a substrate, Silicon dry-etching process, Isotropic etching, etc. | |
Metal MNs | Three-dimensional laser ablation, laser cutting (stainless less), metal electroplating methods (palladium), wet etching photochemical etching (titanium), etc. | ||
Ceramic MNs | Ceramic micro molding and sintering lithography, etc. | [5] | |
2. | Coated MNs | Dipping or spraying, layer-by-layer (LbL) coating techniques | [5] |
3. | Hollow MNs | Deep reactive ion etching of silicon, deep X-ray photolithography, wet chemical etching, and microfabrication, Integrated lithographic molding technique, etc. | [5] |
4. | Dissolving MNs | Micromolding | [5] |
5. | Polymeric MNs | Photolithography, micro molding, casting, hot embossing, injection molding, investment molding, etc. |