Table 5 P Results of robustness of OLP and SMD
Parameter | Variation | OLP | SMD | ||||||
|---|---|---|---|---|---|---|---|---|---|
Peak Area *(Mean ± SD) | % RSD | Plate Count | Tailing | Peak Area *(Mean ± SD) | % RSD | Plate Count | Tailing | ||
Mobile phase (± 1 mL) | 71:29 | 626,632 ± 4266.0 | 0.7 | 2787 | 1.73 | 260,172 ± 1968.9 | 0.8 | 3435 | 1.57 |
69:31 | 401,774 ± 1345.3 | 0.3 | 2612 | 1.74 | 242,845 ± 760.9 | 0.3 | 3302 | 1.66 | |
Temperature (± 5ºC) | 25 °C | 315,006 ± 346.3 | 0.1 | 2691 | 1.71 | 195,916 ± 534.7 | 0.3 | 3283 | 1.63 |
35 °C | 343,675 ± 2069.0 | 0.6 | 2659 | 1.75 | 211,199 ± 1182.7 | 0.6 | 3039 | 1.59 | |
Flow rate (± 0.1 mL/min) | 0.2 | 323,962 ± 1868.4 | 0.6 | 2710 | 1.68 | 204,923 ± 843.0 | 0.4 | 3372 | 1.65 |
0.4 | 285,488 ± 661.6 | 0.2 | 2602 | 1.75 | 181,521 ± 359.1 | 0.2 | 3231 | 1.53 | |